Diamond Cutting Blade For PCB Circuit Board

Precision Diamond Blades for Flawless PCB Cutting

Achieve exceptionally clean, precise, and high-yield cuts on delicate and complex Printed Circuit Board (PCB) materials with these specialized Diamond Cutting Blades. Engineered specifically to meet the rigorous demands of the electronics manufacturing industry, they ensure superior edge quality and minimal material waste when processing diverse circuit board composites.

Engineered for Cutting Delicate Electronic Materials

Success in PCB dicing and cutting hinges on specialized tool characteristics, which these blades deliver:

• Optimized Diamond Abrasive: Utilizes carefully selected and graded diamond particles, chosen for their sharp cutting edges and ability to slice efficiently through mixed materials (like copper, fiberglass, resin, ceramics) with minimal thermal impact and mechanical stress on sensitive components.
• Advanced Bronze/Metal Bond Matrix: The robust bronze/metal bond system securely anchors the diamond particles, offering excellent wear resistance for a long tool life. This thermally conductive bond also helps dissipate heat effectively from the cutting zone, crucial for preventing damage. Furthermore, the bond formulation is designed to minimize material loading and adhesion.
• Exceptional Sharpness & Non-Stick Performance: This synergistic combination results in an extremely sharp, free-cutting action that significantly reduces cutting forces. The inherent non-stick properties minimize residue build-up, ensuring clean cuts even when processing materials prone to melting or smearing.

Delivering Superior Cut Quality and Process Efficiency

Using these diamond blades yields significant improvements in production outcomes:

• Clean, Burr-Free Edges: Produces exceptionally smooth, precise cuts with minimal chipping, delamination, or burring, critical for maintaining circuit integrity and facilitating subsequent assembly processes.
• High Dimensional Accuracy: Manufactured to stringent dimensional controls. Standard thickness tolerance is typically ±0.005mm for 1A1 shapes and ±0.01mm for 1A1R shapes, enabling highly accurate, consistent kerf width for repeatable cuts essential in high-density PCB processing and SMT semiconductor dicing.
• Excellent Surface Finish: Leaves a high-quality, consistent surface on the cut edge, often reducing or eliminating the need for secondary deburring or finishing operations.
• Outstanding Durability & Lifespan: The combination of high-quality diamonds and a wear-resistant metal bond matrix provides significantly longer operational life compared to conventional abrasive blades, reducing tool change frequency and overall cost per cut.

Compatibility and Full Customization

Designed for seamless integration and tailored performance:

• Machine Compatibility: Intended primarily for use on standard precision PCB cutting machines, depaneling systems, and potentially compatible high-precision dicing saws used in semiconductor manufacturing.
• Extensive Specification Options: Available in numerous standard and custom configurations based on Diameter (D), Thickness (T), and Bore/Arbor Hole (H). Common examples include:
  • D100 (e.g., 100mm x 0.3mm x 12.7mm)
  • D125 (e.g., 125mm x 0.4mm / 0.5mm x 12.7mm)
  • D180 (e.g., 180mm x 0.63mm x 12.7mm)
  • D203 (e.g., 203mm x 0.80mm x 22mm)
• Fully Customizable Solutions: We specialize in manufacturing blades tailored precisely to your application. This includes custom dimensions (D, T, H), specific diamond grit sizes and concentrations, variations in bond formulation, and required wheel shapes (e.g., standard 1A1 peripheral wheel, 1A1R radius edge).

Contact our application specialists to discuss your specific PCB or semiconductor cutting challenges and let us engineer the optimal diamond blade solution.